A revolutionary system that provides powerful support for the development of new materials for the future.
This sintering system also allows convenient and easy operation in an ordinary environment.
High-speed spark plasma sintering creates sintered compacts from a variety of powders. It is capable of sintering powdered beryllium, aluminum, titanium, molybdenum, and other materials which are difficult to sinter by conventional methods. It can also easily sinter ultra-hard alloys and non-metallic material such as carbon and fine ceramics – a process which previously required much time. Ed-Pas is able to create special alloys from a variety of powders, perform weld shaping at the same time when sintering powders, and perform other services that are essential when developing materials for a new age.
When pulse voltage is directly applied to a powder, micro-discharges occur in the spaces between the powder particles, generating plasma. This shock vaporizes impurities such as oxide films and absorption gas on the surfaces of the particles. At the same time, the particle surfaces are activated by the build-up of heat and strain energy. Next a special power source generates Joule heat at the locations where the activated particles are in contact, causing thermal diffusion. Electrodiffusion caused by the voltage occurs in parallel at this time, allowing sintering to be completed within short times ranging from several tens of seconds to several minutes.
Because with Ed-Pas, electrical energy acts directly on the powder, and because the activation caused by electrical discharge occurs in parallel with thermal diffusion and electrodiffusion caused by current application, this system provides a number of features which are not possible with conventional sintering methods.
Electromagnetic materials, mechanical materials, diamond tool materials, dental materials, wear-resistant materials, friction material, carbide materials, heat resistant materials, ultra high-temperature materials, amorphous materials, nano-micron materials, intermetallic compounds, porous materials, functionally graded materials, composite materials, fibrous materials, ceramic materials, carbon materials, others
Item |
Specification | |||
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Ed-Pas III (5 models) | Ed-Pas IV (4 models) | Ed-Pas V | ||
Maximum pressure force | (KN) | 50 - 100 | 50 - 100 | 200 or higher |
PAS current | (A) | 400 - 800 | 1,000 | 2,000 or higher |
Maximum electrical power | (A) | 3,000 - 5,000 | 5,000 - 10,000 | 15,000 or higher |
Maximum input | (KVA) | 25 - 85 | 85 - 170 | 315 or higher |
Maximum service temperature | (℃) | 1,200 - 2,800 | 2,800 | 3,000 |
Stroke | (mm) | 70 - 100 | 100 | 200 or higher |
Coolant | 0.2 – 0.3 MPa, minimum 20 L/min (water) | |||
Sintering atmosphere | Atmosphere, vacuum, gas atmosphere | |||
System configuration |
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High-speed spark plasma sintering creates sintered compacts from a variety of powders. It is capable of sintering powdered beryllium, aluminum, titanium, molybdenum, and other materials which are difficult to sinter by conventional methods. It can also easily sinter ultra-hard alloys and non-metallic material such as carbon and fine ceramics - a process which previously required much time. Ed-Pas is able to create special alloys from a variety of powders, perform weld shaping at the same time when sintering powders, and perform other services that are essential when developing materials for a new age.
Material during sinter bonding (100mm × 200mm)
Aluminum sintering sample (Maximum size:100mm × 200mm)
Copper sintering sample(Maximum size:100mm × 200mm)
Item | Specification | |
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Maximum pressurizing force | (KN) | 400 |
Stroke | (mm) |
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PAS current | (A) | 5,000 |
Maximum electrical power | (A) | 15,000 |
Maximum input | (KVA) | 300 |
Maximum service temperature | (℃) | 2,000 |
Temperature measurement device |
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Coolant | 0.2 – 0.3 MPa, minimum 20 L/min | |
Sintering atmosphere | Atmosphere, vacuum, inert gas | |
External dimensions of vacuum chamber | (mm) | 700 (width) × 520 (depth) × 540 (height) |
Sintering atmosphere | Atmosphere, vacuum, gas atmosphere | |
System configuration |
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