Mask Disk Writers
Exposure Systems
ABM-USA, Inc. provides a wide variety of sizes and configurations for Stand Alone UV Exposure Systems including 4", 6", and 8" round/square exposure beams with Near-UV (NUV), Mid-UV (MUV) and Deep-UV (DUV) wavelengths and 350W, 500W, 1,000W or 2,000W Constant Power/Constant Intensity Controlling Power Supplies.
ABM-USA, Inc. Exposure Systems are available with external Shutter Timers, Support Stands with Light Shields, and Slide Out Drawers with Vacuum Chucks to secure/pre-align 2", 3", 4", 6" wafers/substrates and Vacuum Mask Holders to secure/pre-align 2", 2.5", 3", 4", 5", 6", or 7" masks.
Slide Out Drawer Systems controls include:
- Substrate Vacuum On/Off
- Contact Vacuum On/Off
- Auto-Planarization
- Z-axis Proximity Gap setting (0~6 mm)
- N2 On/Off
- N2 level adjustment
- N2 and Vacuum gauges
Intensity Meters And Probes
2-Channel Digital Intensity Meter with:
- Compact hand-held size
- Large 8-segment LCD display
- Scale selection with operating ranges from 0-20 mW/cm2 or 0-200 mW/cm2
- Wavelength channel selection
- On/Off and Hold selection
- Calibrated detectors with NIS traceability
- Operates on 9 Volt battery with (typical) lifetime of 150 hours
- Dual wavelength probe for:
- 280/310 nm
- 260/280 nm
- 220/254 nm
- 365/400 nm
Vacuum Chucks
Standard Fixed Level and Planarizing Vacuum Chucks:
Single die and piece-parts
- 2" wafer or substrate chuck
- 3" wafer or substrate chuck
- 4" wafer or substrate chuck
- 6" wafer or substrate chuck
- 8" wafer or substrate chuck
Custom Fixed Level and Planarizing Vacuum Chucks available upon request
Combination Fixed Level or Planarizing Vacuum Chucks:
Combination vacuum chucks have multiple vacuum lines which can be individually selected and closed off as required
Backside Visible Vacuum Chucks:
(2) spot Backside Visible (BSV) chucks for 2" up to 8" wafer/substrates BSV have (2) illuminated areas on wafer center-line that are approximately 0.75" to 1.0" diameter illuminated via adjustable intensity fiber optic illuminators and fiber pipes. Minimum 1.0" split-field separation in X-direction and +/-0.8" movement in Y-direction.
- (2) Co-axial fiber optic illuminators
- (2) XYZ micrometer stages
- (2) fixed magnification tubes
- (2) 2x adapters
- (2) 1/4" CCD cameras
Image Grabbing System Hardware and Software with Image Overlay Function
BSV alignment accuracy down to +/-1 micron
Backside Infrared Vacuum Chucks:
(2) spot Backside Infrared (BSIR) chucks for 2" up to 8" wafer/substrates BSIR chucks have(2) illuminated areas on wafer center-line that are approximately 0.75" to 1.0" diameter illuminated via adjustable intensity fiber optic illuminators and Quartz fiber pipes. Chucks can also be purchased with (4) or (6) illuminated spots. Requires use of Dual CCD cameras for IR imaging with infrared sensitivity from 0.8 to 1.2 microns
BSIR alignment accuracy down to +/-1 micron
Custom Recessed Vacuum Chucks:
Standard vacuum chucks can be used for wafer/substrate thickness up to maximum 0.25" (6 mm). Thicker wafers/substrates can be accommodated with custom recessed vacuum chucks
Vacuum Mask Holders
Top-Load Vacuum Mask Holders Sizes (round or square opening)
2", 2.5" 3", 4", 5", 6", 7", & 9"
Bottom-Load Vacuum Mask Holders Sizes (round or square opening)
2", 2.5", 3", 4", 5", 6", & 7"
Top-load and Bottom-load Vacuum Mask Holders are available for any mask size and thickness including standard 0.060", 0.090", and 0.120" or any thickness
Custom mask holders are available upon request
All mask holders include per-alignment/stop pins for precision and repeatable placement of photomasks on mask holders
