Ellipsometry

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Ellipsometry

SPECTROSCOPIC ELLIPSOMETER SE SERIES

Spectroscopic Ellipsometer SE series are advanced models built by Angstrom Sun Technologies Inc. Ellipsometry is a technique utilizing polarization state changes after light beam reacts with probing samples. A typical ellipsometer setup includes a light source, polarizing optics (like polarizer, analyzer, phase retarder or called as compensator), sample stage, detecting unit, incident angle change mechanism, computer and software for data acquisition and modeling. Not like reflectometer, ellipsometer parameters (Psi and Del) are always obtained at non normal incident angles. By varying incident angle. many more data sets can be obtained which will be helpful in refining model, reducing uncertainty and improving user's confidence on model's output. Therefore, variable angle ellipsometer is far more powerful than fixed angle ellipsometers. Furthermore, by utilizing broadband light source, spectroscopic data over a wavelength range with many wavelength points can be obtained and thus measurement precision and accuracy for optical properties can be greatly improved. The measurement speed for spectroscopic data has been overcome by implementing an advanced detector array so thousands of data can be acquired simultaneously. With such configuration and capable of collecting more data sets, the complicated layer stacks could be analyzed with powerful functions built within software.

There are two ways to change incident angles, manually or automatically. Angstrom Sun technologies Inc designed both angle adjustment models, manually adjusting angle by moving arms at 5-degree interval following precisely preset slots (manual goniometer, SExxxBM, low cost version), and motorized precision goniometer with 0.001-degree resolution (SExxxBA). In addition, goniometers are setup at vertical layout so samples could be placed horizontally, which is safer when handling samples. With reliable and enough raw data sets, many film properties, like film thickness, its optical constants, interface, porosity and even composition can be obtained through modeling. In this sense, advanced software is a must for high performance SE tools. We developed TFProbe 3.X version software for system setup. simulation, measurement, analysis, data management and 2D/3D graphics presentation. It is all-in-one.

Measuring Ellipsometry Data Principle:

Hardware configuration for spectroscopic ellipsometer is application oriented and it is not necessary to “overload” by inquiring all available options. Polarization states are generated or modulated by polarizer, compensator, and then reflected with changes after sample under measuring, finally analyzed by an analyzer before reaching detector. Interpretation on signal, a set of ellipsometry parameters Psi and Del will be output and recorded.

However, ellipsometry is an indirect technique and quantities under interest (thickness, optical properties etc.) can only be obtained through modeling.

By building a model to calculate a set of ellipsometry parameters and then compared to experimentally obtained ones. The difference between two sets of values is minimized by varying variables defined in the model by Levenberg–Marquardt algorithm.

Here n is total wavelength points and m is variables in model. A certain experience in modeling is required to use such tool and therefore application support for initial use or learning is essential step.

SPECTROSCOPIC ELLIPSOMETER DUV-VIS-NIR

Spectroscopic ellipsometer can be configured to cover broad wavelength range from DUV to NIR. DUV range is useful to measure ultra thin films, like nanometer thickness range. One example is the native oxide on silicon wafer, which is typically about 1 to 2nm thick only. Deep UV spectroscopic ellipsometer is also essential when user needs to measure band gaps of many materials. Visible or Near Infrared range is used to measure relative thick or very thick coatings. Of course, the tool's wavelength range should be configured to the range if optical constants must be determined. Other configurations, like wavelength resolution, angular range etc, is to be consdiered based on desired applications. Please contact us to discuss available standard configurations or to customize a tool to meet your special applications.

Features

  • Easy to operate with Window based software
  • Advanced optics design for best system performance
  • High Power DUV-VIS-NIR light source for broad band applications
  • Array based detector system to ensure fast measurement
  • User can define as many layers as they want
  • Capable to be used for real time or in-line thickness, refractive index monitoring
  • System comes with comprehensive optical constants database and library
  • Advanced TFProbe 3.3.X Software allows user to use either NK table, dispersion or effective media approximation (EMA) for each individual film.
  • Three different user level control: Engineer mode, system service mode and easy user mode
  • Flexible engineer mode for various recipe setup and optical model testing
  • Robust one-click button (Turnkey) solution for quick and routine measurement
  • Configurable measurement parameters, user preference and easiness of operation
  • Fully automatic calibration and initialization for system
  • Precise sample alignment interface from sample signal directly, no external optics needed
  • Precise height and tilting adjustment
  • Apply to many different types of substrates with different thickness
  • Various options, accessories available for special configurations such as mapping stage, wavelength extension, focus spot etc.
  • 2D and 3D output graphics and user-friendly data management interface

System Configuration

Model

SE200

(DUV-Vis)

SE300

(Vis)

SE450

(Vis-Nir)

SE500

(DUV-Vis-Nir)

Detector Type

CCD or CMOS Array

CCD or CMOS Array

CCD or CMOS and InGaAs Array

CCD or CMOS and InGaAs Array

Wavelength Range (nm)1

190 to 1100

370 to 1100

370-1700

190-1700

Wavelength Points

Both measurement wavelength range and wavelength data points are User definable in recipe (data points are limited by resolution only)

Wavelength Resolution2

0.01 -3nm

0.01 -3nm

0.01 to 3nm

0.01 to 3nm

Data Acquisition Time

100 milliseconds to 10s, user definable

Incident Angle Range3

20 to 90 degree

Incident Angle Resolution

5-degree preset step with manual goniometer for SExxx-BM configurations;

Program controlled 0.001-degree resolution with automatic goniometer for SExxx-BA configurations

Polarizing Optics

A combination of rotating polarizer, analyzer and/or compensator

Beam Size4

Collimated beam with beam size adjustable from 1 to 5mm with aperture; Optional focus beam mode(detachable) is available with reduced spot size

Light Source5

(D2+TH)/Xe

TH

TH

(D2+TH)/Xe

Lifetime of Lamp(s)

4000 hrs.

10000 hrs.

10000 hrs.

4000 hrs.

Measurable Thickness Range6

up to 30 µm

20nm to 50 µm

20nm to 50 µm

up to 50 µm

Thickness Precision7

< 1Å or 0.1%

Index Precision7

Better than 0.0001

Thickness Accuracy7

better than 0.25%

Sample Holder

Black Anodized Aluminum Alloy vacuum chuck, typically with a dimension of 150x150mm or 200mm in diameter; other sizes (ex. 450mm) are available per request or based on automatic mapping travel range to configure

Z Stage

Precision Z stage with typical 12mm travel range for sample height adjustment, Motorized Z stage is optional, travel range could be customized up to 50 mm (~ 2”)

Tilting Alignment

A Three-point tilting manual alignment mechanism is typically equipped with non-mapping tools, motorized automatic tilting is available as option; For automatic mapping tools, pre-leveled stage without further tilting adjustment is delivered.

Software

TFProbe 3.3 all-in-one software, free lifetime upgrades

Operation modes

Administrator, service engineer, scientist/engineer, operator

Communication

USB

Operating System

Both 32bit and 64 Bit, Win XP, 7, 8, 10

Computer

Intel i3, 500 GB space, 4GB RAM; 22” LCD Monitor or equivalent Laptop

Power Input

World-wide, universal 110– 240 VAC /50-60Hz, 3A

Platform

Tabletop, ex-situ or in-situ; or integration;

Weight/Dimension

~ 150 lbs. / 38(L)x22(D)x34(H)”

Power Input

World-wide, universal 110– 240 VAC /50-60Hz, 3A

Shipping Weight/ Dimension

~300lbs / 48x40x42”

Options

  • Photometry measurement for Reflection and/or Transmission Measurement:  -R/-T
  • Micro spot for measuring small area:  - MSxxx (ex. -MS120 focus down to 120um spot size)
  • Automatic Goniometer for Incident angle changes – SExxxBA
  • Manual Goniometer for Incident angle changes – SExxxBM
  • Mapping Stage with various ranges SExxxBM-Myyy (-M300: Rho-Theta style, up to 300mm size wafer) or SE200BM-MXxxxYxxx(ex. -MX150Y150: X-Y style with X 150mm and Y 150mm)
  • Heating /Cooling Stage: -Hxxx (ex. -H325: heating up to 325oC)
  • Vision and Digital Imaging Attachment:  -V
  • Wafer Measurement add-on for bow, warp or wafer thickness
  • Wavelength extension to further IR range (IRSE)
  • Scanning Monochromator Setup: SExxxAM (A stands for A type detecting, i.e. Monochromator; B stands for B type detecting, i.e. array based detector type)
  • SE setup with wafer loader automation
  • Combined with MSP for patterned sample measurement with digital imaging functions

Applications

  • Semiconductor fabrication (PR, Oxide, Nitride..)
  • Liquid crystal display (ITO, PR, Cell gap…..)
  • Forensics, Biological films and materials
  • Inks, Mineralogy, Pigments, Toners
  • Pharmaceuticals, Medical Devices
  • Optical coatings, TiO2, SiO2, Ta2O5…..
  • Semiconductor compounds
  • Functional films in MEMS/MOEMS
  • Amorphous, nano and crystalline Si
  • Photovoltaic thin films, CdTe, CdS, CIGS, AZO, CZTS.....

NOTE:

  • System configuration and Specifications subject to change without notice
  • * Film property, surface quality and layer stack dependent
  • Customized system available for special applications
  • TFProbe is registered trademark of Angstrom Sun Technologies Inc

SPECTROSCOPIC ELLIPSOMETER IRSE

Spectroscopic ellipsometry (SE) is a well-established optical technique for the characterization of bulk materials, thin films, coatings, both surface and embedded layers. The wavelength range implemented with such technique is always application dependent. The infrared (IR) wavelength range is of much interest since materials exhibit behavior which are very different from those observed in the ultra-violet(UV) and visible wavelength ranges. For example, most non-doped semiconductors are transparent; dielectrics have characteristic absorption bonds; metals or doped semiconductors exhibit Drude absorption tails etc. Therefore, InfraRed Spectroscopic Ellipsometry (IRSE) allows to characterize for structural (thickness, interface, surface roughness, contamination), optical (optical constants), electrical (conductivity) and also chemical information of materials.


Features

  • Horizontal sample placement
  • Affordable, Low Cost
  • Compact design
  • Easy to use with Window based software; scientific mode for advanced users and operator mode for routine/daily operations
  • Variable Incident angles
  • User definable resolution
  • Fast measurement based on FTIR technique
  • Comprehensive optical constants database and model recipes
  • Advanced TFProbe Software allows user to define layers with NK table, dispersion or EMA mixture/composites with index grading, and surface/interface roughness...
  • Upgradable and reconfigurable with Various options and accessories
  • Michelson interferometer with continuous dynamic alignment for long-term stability
  • Long Lifetime Infrared Source

System configuration

  • Model: TFProbe IRSE
  • Light Source: Long Lifetime Polaris™ Infrared Source
  • Spectrometer:
    • Michelson interferometer Dual ports output
    • Ge on KBr beamsplitter
    • High-precision HeNe reference laser
    • Continuously variable iris aperture
    • BaF2 coated KBr windows
  • Variable Incident angle: 20 – 90 degree at 5-degree interval
  • Angle Change Mode: Manual with preset slots
  • Polarizing Optics: Motorized Grid IR Polarizers
  • Detector: TE-cooled DLaTGS detector with KBr window
  • Stage: High Precision Z stage with tilting adjustment
  • Sample Plate: 200mm diameter, Horizontal placement
  • Communication: USB 2.0
  • Computer: Intel i5 processor, 8GB ram and 500GB Hard Drive with Keyboard and Mouse
  • Monitor: 22” LCD Monitor
  • Software: TFProbe 3.3

Specification

  • Spectral range:                    350 - 7400 cm-1
  • Spectral Resolution:            0.5 - 32 cm-1
  • Wavelength Precision:        Better than 0.01 cm-1
  • Scanning Velocity:               0.158 – 6.28 cm/sec
  • Spot size:                              1 - 5 mm
  • Angle of incidence:             20° to 90°, 5o interval
  • Measurement time:            5 sec/site to several min, user definable
  • Measurement precision:    better than 1Å for Thermal SiO2/Si

Options

  • Detector: MCT-A (400 – 11700cm-1); MCT-B (600 – 11700cm-1); MCT-C (800 – 12500cm-1)
  • Incident Angle: Motorized Goniometer for changing incident angle automatically at   0.01 degree
  • Sample Holder: up to 450mm size
  • Motorized mapping stage at X-Y or Rho-Theta to cover up to 450mm wafer size
  • Reflection and/or transmission measurement
  • Heating and Cooling Stage
  • Digital Vision with imaging functions
  • Focused beam set up for small area measurement

  • Bulk materials: Glasses, PET, Doped silicon
  • Silicon epitaxial layers:
    • doping profile
    • thin epilayers (< 1 um)
    • low contrast N-/N epilayers
  • Semiconductor epilayers (GaAs, Insb, SiC, SiGe, CdHgTe, …)
  • Dielectric films characterization
  • Silicon layers for FPD applications
  • Monitoring of a-Si:H process quality (CVD, ELA process)
  • Si-H and N:H relative content in SiN layers
  • ITO films: optical and electrical characterization
  • BPSG, PSG: boron and phosphorus concentration
  • Low-k materials: 
    • Organic low-k material.
      • Determine the thickness and optical constants
      • Calculate the carbon content (% C).
      • Determine the water content before and after annealing
    • SiOC:H: carbon content and porosity.
    • Porous SiO2: thickness, porosity, water content.
  • Trench, Vias, Recess and shallow trench isolations (STI)  
  • SOI Optical Waveguides: thickness measurements.

NOTE:

1. System configuration and Specifications subject to change without notice.

2. * Film property, surface quality and layer stack dependent

3. Customized system available for special applications

4. TFProbe is registered trademark of Angstrom Sun Technologies Inc.

5. MCT: HgCdTe, Mercury Cadmium Telluride

6. DTGS: Deuterated Triglycine Sulfate

7. DLaTGS: Deuterated Lanthanum α Alanine doped TriGlycine Sulphate

SPECTROSCOPIC ELLIPSOMETER MICROSPECTROPHOTOMETER SE-MSP

Angstrom Sun technolgies Inc provides a solution to work on ultra thin films with Ellipsometry and also a micron small area with micro-reflectometry, a unique configuration by combining ellipsometer and microspectrophtometers. TFProbe 3.3 version software will handle both measurements and analyses.

A small probing spot is desired for some applications, like features on MEMS or semiconductor product wafers. After microspectrophotometer is  integrated with spectroscopic ellipsometer, tool's capability is greatly extended. Model SE-MSP is designed for such purpose. MSP works under reflectometry mode and run measuremment at normal incident angle which is complimentary to non-normal incident angle SE setup.  Wavelength ranges for SE and MSP can be configured differently, based on application needs. All options are selectable.

Features

  • Easy to operate with Window based software
  • Advanced optics design for best system performance
  • Automatically change incident angles at 0.001 degree resolution with SExxxBA options
  • High Power light source for broad band applications
  • Array based detector system to ensure fast measurement
  • Measure film thickness and Refractive Index for multiple layers, allow user to design model with unlimited layers
  • System comes with comprehensive optical constants database and library
  • Advanced TFProbe 3.3 Software allows user to use either NK table, dispersion or effective media approximation (EMA) for each individual film.
  • Three different user level control: Engineer mode, system service mode and easy user mode
  • Flexible engineer mode for various recipe setup and optical model testing
  • Robust one click button (Turn-key) solution for quick and routine measurement
  • Configurable measurement parameters, user preference and easiness of operation
  • Fully automatic calibration and initialization for system
  • Precise sample alignment interface from sample signal directly, no external optics needed
  • Precise height and tilting adjustment
  • Apply to many different type of substrates with different thickness
  • Various options, accessories available for special configurations such as mapping stage, wavelength extension, focus spot etc.
  • 2D and 3D output graphics and user friendly data management interface
  • Digital Imaging Tool for Micron region selection
  • Integrated Reflectometer for Reflection measurement over small region

Specifications:

  • Spot Size: 1 to 5 mm variable for SE (beam size can be reduced with microspot option)
  • Incident Angle Range: 30 to 90 degree
  • Incident Angle Change Resolution: 0.001 degree with automatic goniometer or 5 degree step with manual goniometer
  • Digital Imaging: 1.3 MegPixels or better
  • Effective Magnification: 1200x
  • Long Work distance objective (12mm)
  • MSP Beam Size: adjustable 10 - 500 um
  • Sample Size: up to 300 mm in diameter
  • Substrate Size: up to 20mm thick
  • Measurable thickness range*: 0 nm to 50 µm
  • Measurement Time: ~ 1s/Site
  • Accuracy*: better than 0.25%
  • Repeatability*: < 1 Å (1 sigma from 50 thickness readings for 1500 Å Thermal SiO2 on Si Wafer)

Options

  • Transmission Measurement Module
  • High resolution digital camera
  • Ultra Long work distance objective for MSP
  • Mapping X-Y Stage (X-Y mode, instead of Rho-Theta mode)
  • Heating /Cooling Stage
  • Vertical Sample Mounting Goniometer
  • Wavelength extension to further DUV or IR range
  • Scanning Monochromator Setup

Applications

  • Semiconductor fabrication (PR, Oxide, Nitride..)
  • Liquid crystal display (ITO, PR, Cell gap…..)
  • Forensics, Biological films and materials
  • Inks, Mineralogy, Pigments, Toners
  • Pharmaceuticals, Medial Devices
  • Optical coatings, TiO2, SiO2, Ta2O5…..
  • Semiconductor compounds
  • Functional films in MEMS/MOEMS
  • Amorphous, nano and crystalline Si

NOTE:

  • System configuration and Specifications subject to change without notice
  • * Film property, surface quality and layer stack dependent
  • Customized system available for special applications
  • TFProbe is registered trademark of Angstrom Sun Technologies Inc.

SPECTROSCOPIC ELLIPSOMETER SE-SOLAR

Spectroscopic ellipsometer SE-Solar is designed for Photovoltaic(PV) application. It can be configured to cover DUV to NIR range with manual goniometer for incident angle changes at 5 degree interval or an automatic goniometer with 0.001 degree resolution. Array based detecting setup gives user a fast measurement, just in seconds for each data. When a mapping or real time in situ measurement is needed, this is the best choice among all SE models. Wavelength range can be extended up to 1700nm if requested, as an option for some applications like CdTe, CIGS film characterization. A tilting stage for measuring films on the textured mono wafers. Dependent on needs, a combined DUV and Vis-NIR light source or a single Arc Xenon light source is available for use. In the product photo, a 156x156mm motorized mapping stage is equipped. In addition, a reflectometer at normal incidence can also be integrated together. There are several other options available. Please fell free to contact us for any special needs. It's our goal to provide a tool, whatever it is standard configuration or it is customized, to meet your application needs.

Features

  • Easy to operate with Window based software
  • Advanced optics design for best system performance
  • High Power combined DUV-VIS light source or Xenon Arc light source for broad band applications
  • Array based detector system to ensure fast measurement
  • Measure film thickness and Refractive Index simultaneously
  • System comes with comprehensive optical constants database and library
  • Advanced TFProbe 3.3 Software allows user to use either NK table, dispersion or effective media approximation (EMA) for each individual film.
  • Three different user level control: Engineer mode, system service mode and easy user mode
  • Flexible engineer mode for various recipe setup and optical model testing
  • Robust one click button (Turn-key) solution for quick and routine measurement
  • Configurable measurement parameters, user preference and easiness of operation
  • Fully automatic calibration and initialization for system
  • Precise sample alignment interface from sample signal directly, no external optics needed
  • Precise height and tilting adjustment
  • Apply to many different type of substrates with different thickness
  • Various options, accessories available for special configurations such as mapping stage, wavelength extension, focus spot etc.
  • 2D and 3D output graphics and user friendly data management interface

Specification

  • Wavelength range: 250 to 1100 nm or 370 to 1100nm (Up to 1700nm)
  • Wavelength resolution: 1 nm
  • Spot Size: 1 to 5 mm variable
  • Incident Angle Range: 0 to 90 degree
  • Incident Angle Change Resolution: 5 degree interval with manual goniometer or 0.001 degree with auto goniometer
  • Sample Size: up to 160x160 mm
  • Substrate Size: up to 20mm thick
  • Measurable thickness range*: 0 nm to 20 µm
  • Measurement Time: ~ 1s/Site
  • Accuracy*: better than 0.25%
  • Repeatability*: < 1 Å (1 sigma from 50 thickness readings for 1500 Å Thermal SiO2 on Si Wafer)

Options

  • Transmission Measurement
  • Micro spot for measuring small area
  • Automatic Goniometer or manual goniometer for Incident angle changes
  • Other size or mode Mapping Stage
  • Heating /Cooling Stage
  • Wavelength extension to further DUV or IR range
  • Scanning Monochromator Setup
  • Combined with MSP for patterned sample measurement with digital imaging functions
  • Other Tilting accessories for special substrate applications

Applications

  • Antireflection coatings, SiNx, SiOx..
  • CdTe, CIGS, CdS, Mo....
  • Amorphous, nano and crystalline Si
  • Various TCO films (ITO, FTO, IZO, AZO...)

NOTE:

  • System configuration and Specifications subject to change without notice
  • * Film property, surface quality and layer stack dependent
  • Customized system available for special applications
  • TFProbe is registered trademark of Angstrom Sun Technologies Inc.

SPECTROSCOPIC ELLIPSOMETER WITH AUTOMATION

Spectroscopic ellipsometry (SE) is a well-established optical technique for the characterization of bulk materials, thin films, coatings, both surface and embedded layers in non-destructive and non-contact ways. For routine and fab processing quality control, an automatic cassette handler is a must. Angstrom Sun Technologies Inc. has developed a low-cost solution to cover wafer size from 2” to 8” in a desktop style and 12” in tower style for this purpose. User can define a recipe for a whole cassette measurement, even with recipes for each slot.

Features

  • Horizontal sample placement
  • Affordable, Low Cost
  • Compact Design
  • Easy to use with Window based software; scientific mode for advanced users and operator mode for routine/daily operations
  • Variable Incident angles, user definable resolution
  • Comprehensive optical constants database and model recipes
  • Advanced TFProbe Software allows user to define layers with NK table, dispersion or EMA mixture/composites with index grading, and surface/interface roughness...
  • Upgradable and reconfigurable with Various options and accessories
  • Wafer Thickness: 200µm to 1mm (bow <1.5mm, no warpage)
  • Front Load Cassette
  • High speed elevator with sensors
  • Cassette Mapper included (detects empty slots and crossed slotted wafers)
  • Stage Load Sensor included
  • Pre-aligner included for flats or notches
  • EMO emergency shutdown switch
  • Center contact End effector matches wafer holder on ellipsometer tool
  • Clean room compatible
  • Easy access adjustable leveling feet and to be bridge connected to Ellipsometer frame firmly
  • Compact design with all electronics built inside loader
  • Universal power input
  • USB communication to Computer, sharing one computer and monitor with Ellipsometer
  • Upgraded TFProbe SW with Integrated wafer handling for easy operation
  • Specially designed New Wafer Holder with vacuum chuck to hold wafer in position

Application

  • Semiconductor fabrication (PR, Oxide, Nitride..)
  • Liquid crystal display (ITO, PR, Cell gap…..)
  • Optical coatings, TiO2, SiO2, Ta2O5…..
  • Semiconductor compounds
  • Functional films in MEMS/MOEMS
  • Amorphous, nano and crystalline Si
  • Photovoltaic thin films, CdTe, CdS, CIGS, AZO, CZTS.....

TFPROBE ESE

It is affordable and true spectroscopic tool. It comes with advanced TFProbe 3.3 software for system configuration, data acquisition, simulation and regression. Different user log-in level allows Scientists/Engineers to play complicated layer stacks, isotropic/anisotropic, super-lattice, inhomogeneous with various index profile builder, while operator mode provides one-button click to have results, plus lifetime software upgrade without cost and professional application support.

Features

· Specifically designed for education and small R&D activities

· Affordable but still advanced and powerful as those expensive tools

· True spectroscopic Ellipsometer (not single wavelength laser, not LEDs narrow band)

· Table top and Easy to set up, Plug and Play

· Easy to operate with all Window OSs

· Advanced optics design for best system performance

· Variable Angle from 45 to 90 degree range

· Long life (over 10000hrs) ultra stable Vis-NIR light source for broad band applications

· Array based detectors allow fast measurement

· Measure film thickness and Refractive Index up to 120 layers

· System comes with comprehensive optical constants database and model recipes

· Advanced TFProbe Software allows user to use either NK table, dispersion or effective media approximation (EMA) for each individual film.

· Apply to many different type of substrates with different thickness

· Free Life time software upgrade and application support

Application

  • Wavelength range: 370 - 1100 nm (Visible version)
  • Wavelength resolution: better than 0.5 nm
  • Beam Size: 1 to 5 mm configurable
  • Sample Size: up to 200 mm
  • Measurable Thickness Range: up to 50 um for transparent coatings/films
  • Measurable layers: user definable (there is no limit in software setup)
  • Measurement time: typical 3 seconds, user definable
  • Variable incident angle: 45 to 90 degree at 5 degree preset interval
  • Thickness precision: 0.1 nm or 0.1% of film thickness
  • Index precision: 0.0001

Options

Other wavelength range are available.
Microspots/Small Beam available.
Vision attachments available.

Applications

· Photoresist, polyimide, Oxides, Nitrides

· Optical coatings, TiO2, SiO2, Ta2O5…..

· Semiconductor compounds, Cell gaps

· Functional films in MEMS/MOEMS

· Thin film transistors (TFT) stack

· Conductive oxide: Indium Tin Oxide

· Coatings on medical devices

· Amorphous, nano and crystalline films

· Thin Metal Layers

· Solar Films: CIGS, CdTe…….