Thin Film Deposition Systems

1.Magneto-optical Kerr microscope & magnetometer

ATC ORION SERIES SPUTTERING SYSTEMS

• 10", 12" and 14" chamber Ø
• HV and UHV versions
• 1.5", 2" and 3" sputter sources
• Substrate holders to 6" Ø
• Load lock
• Substrate cassettes 
• Auto-loading
• Computer control
• Custom engineered versions 
• Much more than a tabletop system

ATC FLAGSHIP SERIES SPUTTERING SYSTEMS

• 18" to 34" chamber Ø
  
• HV and UHV versions
  
• 1" to 8" diameter sputter sources
  
• In-situ tilt source option
  
• Substrate holders to 8" Ø
  
• Load locks
  
• Substrate cassettes and masking 
  
• Auto-loading
  
• Computer control
  
• Custom engineered versions 

ATC-B SERIES BATCH COATING SYSTEMS

• Cylindrical or box style chambers  
  
• Load-lock & cassette options  
  
• Circular, triangular or linear sources
  
• Integrated hoist or hinged door
  
• Single, multi-layer or co-deposition 
  
• Configured for your application

R & D MAGNETRON SPUTTERING SOURCES (HV AND UHV)

• Stiletto Series Circular Sources 1"- 4"
  
• Stiletto Series Rectangular Sources
  
• End mounted - for tube coating
  
• Turrets and cluster flanges

• A300-XP UHV Sources 1.5"- 6"
  
• A310 1" UHV Sources
  
• CTM Series Sources
  
• Turrets and cluster flanges

• Convertible target modules
  
• Specialty configurations

PRODUCTION MAGNETRON SPUTTERING SOURCES (HV)

• STX Series Circular Sources 5"-12"
  
• STXL Series Rectangular Sources 75mm x 300 mm to 150 mm x 1.0 m
  

• Open magnet architecture flexibility for tailored uniformity optimization 

• For 360° immersion coating

• For 200 mm wafer batch coating

RF GENERATORS & MATCHING NETWORKS FOR MAGNETRON SPUTTERING

• 100 W for RF bias and small sources
• 300 W, 600 W and 1000W for RF magnetron deposition
• Integral generator/matching network controller - minimal rack space
• Software specifically for magnetron sputtering - intuitive operation
• Programmable power limits 
• Cables included with either "N", "HN" or "7/16 DIN" coaxial connectors

DC GENERATORS FOR MAGNETRON SPUTTERING

• 750 W and 1500 W
• Integral 4 way switchbox inside
• Intuitive interface specifically for magnetron sputtering
• Programmable with power limits, ramping, timing and shutter control

A3DC Generators

• (3) 600 W DC generators in one chassis
  
• Economical supply for systems requiring many DC supplies
• Interfaces with Labview Computer Control via I/O connection
• Passive front panel display

PULSED DC GENERATORS FOR MAGNETRON SPUTTERING

• 1kW, 1.5kW and 5kW models
• Stable at 1% of full power
• 5kHz to 350 kHz variable in 5kHz increments
• True asymmetric bipolar pulsed power 
• 350V to 800V 

HIPIMS GENERATORS FOR IONIZED MAGNETRON SPUTTERING

• 10 kW, 1 MW peak power
• 1 kV, 1 kA, 1-500 Hz pulse frequency
• 400 VAC 3 phase input, 50/60 Hz
• RS-232, RS-485, analog interface
• Active front panel control
  
• DC unit, high power pulsar and cable matching unit

HiPIMS -High Impulse power magnetron Sputtering:

HiPIMS Generators

• 10 kW, 1 MW peak power
• 1 kV, 1 kA, 1-500 Hz pulse frequency
• 400 VAC 3 phase input, 50/60 Hz
• RS-232, RS-485, analog interface
• Active front panel control
• DC unit, high power pulsar and cable matching unit

2.Thermal Evaporation System

Thermal Evaporation Systems

• Price range: $80,000 - $650,000+
• Box style or cylindrical chambers 
• HV & UHV versions available 
• Thermal source array on slide available
• Load lock & cassette options  
• Water cooled shielding as required
• Integrated hoist or hinged door 
• Configured for your application

3.E-Beam Evaporation System

E-Beam Evaporation Systems

• Price range: $140,000 - $650,000+
• Box style and cylindrical chambers 
• HV & UHV versions available 
• Load lock & cassette options 
• Rotary or linear e-beam sources
• Integrated hoist or hinged door
• Single, multi-layer or co-evaporation
• Linear e-gun slide available
• Planetary, heated and cooled substrate holders Configured for your application

4.Ion Assisted and Ion Milling Systems

ATC-IM Ion Milling Systems are versatile tools which are built in a variety of configurations depending on the specific requirement.   Chambers can be either cylindrical or box style and either HV or UHV.  SIMS endpoint detection is optional along with AJA's unique SIMS-IS isolation system which allows the SIMS head/detector to be kept under vacuum whenever the main chamber is vented.  Systems can include computer control, load-lock, auto-loading, a multi-substrate cassette and mask exchange.

a wide variety of available substrate holders with features such as rotation, manual/motorized incident angle adjustment, heating, water cooling, LN2 cooling, backside gas cooling, and electrical isolation or biasing.

These systems can be configured for a broad range of applications ranging from nano pattern delineation to bulk wafer planarization.  AJA manufactures or incorporates either gridless or gridded, RF or DC ion sources, with appropriate grid materials and curvatures for the requirement.  Systems have been manufactured to employ both inert and reactive/corrosive process gases with the appropriate safety gas box included on the equipment. 

5.Pulsed Laser Depostion (PLD)

SMART NanoTool PLD

SVT Associates' SMART (Scientific Materials and Applied Research Tool) Pulsed Laser Deposition System is a unique versatile research tool. Combining pulsed a Laser Ablation system with other deposition techniques, SVT Associates' PLD system offers a broad range of materials and applications. The ability to extend the vacuum capabilities to Ultra High Vacuum base pressures allows the control of unwanted film impurities.

The laser target manipulator accommodates up to six 1" diameter targets (or four 2") in vacuum which are selectable through the controlling computer. Each of the individual targets can be rotated about its axis, which together with the laser scanning provides a uniform erosion of the target. Using this flexibility, a multitude of thin film structures is possible.

Several laser options are available through SVT Associates depending on the application requirements and budget. Optional in-situ monitoring tools such as RHEED provide you with process feedback in Laser MBE. Available load lock sample handling allows the SMART system to interface with other deposition or metrology tools without exposure of the sample to the atmosphere.

For oxide film deposition, to help ensure complete oxidation, the "High Pressure Oxygen Deposition Package" allows you to set up a partial pressure of O2 in chamber during deposition. Substrate heaters and differential pumping of RHEED electron gun for use in oxygen are also available options.

Pulsed Laser Ablation & Deposition Applications:

• Multiple Component Oxides
• High Temperature Superconductors
• Magnetic and Metallic Material Deposition
• Low Vapor Pressure Materials
• MEMS

Laser Ablation System Optional Features:

• Integrated Excimer Laser
• Scanning Laser Optics
• UHV Capable Upgrade
• High Pressure Oxygen Deposition Package
• High Temperature Deposition Package
• Loadlock Sample Introduction
• Additional Deposition Sources
• RHEED and RHEED Image Analysis
• Deposition Rate Monitors
• Integrated Surface Analysis Modules

6.Molecular Beam Epitaxy

Molecular Beam Epitaxy (MBE) is a key technology due to the unique structures and exact dimensional control that can be achieved.

The SVT Associates, Inc. MBE System is a high performance tool which can be configured for a wide range of material applications. SVTA manufactures the MBE systems, deposition sources, and the essential process monitors. SVTA has full growth process knowledge from our experience in our own laboratory and the previous experience of our staff. This integration results in excellent control over quality and cost, to offer the most cost effective tool available for MBE.

SVTA MBE systems offer an ultra-pure environment for precision fabrication of thin film structures for semiconductor, opto-electronic, photovoltaic, and magnetic applications. SVTA MBE Equipment is specially designed for the materials they produce. The MBE Systems are equipped with hardware and software capabilities to monitor, display, and control critical growth parameters.

SVTA Systems are designed around a modular configuration consisting of several functional units. The modular system concept is a flexible and reliable way of adapting to different customer needs. Typically, there are at least two separate modules, one for the deposition process and one for wafer loading/sample preparation. There are other processing modules, such as cluster tool or material analysis modules that may be added depending on the customer needs. Systems with multiple growth modules for “incompatible” materials are available. Each module has its own independent UHV pumping system and can be isolated from other modules by gate valves. This arrangement makes it possible to perform various system functions independently and concurrently: substrate loading, sample treatment, film growth, and sample analysis.

7.Atomic Layer Deposition Systems

Atomic Layer Deposition System Applications:

• High-k Dielectrics
• Nanocoatings
• Surface Modification Layers
• Corrosion protection layers
• Moisture barrier layers
• Device Encapsulations
• MEMS
• Photonic Crystals

Atomic Layer Deposition Equipment Options:

• Load Lock for rapid sample exchange
• Plasma Component
• Ozone Delivery System
• Residual Gas Analysis — QMS
• Quartz Crystal Deposition Monitor
• In-Situ Ellipsometry
• Transfer to UHV deposition systems